Client: Duni
Ensuring a long lifetime for Duni’s high-quality LED products depends heavily on keeping the component’s junction temperature as low as possible. In this project, resolvent partnered with Duni to conduct an advanced product optimization analysis. By utilizing a conjugate heat transfer simulation approach, we evaluated the thermal distribution and behaviour of the Duni LED plug under real operating conditions.
Figure 1: Duni LED plug and Analysis Snapshot
Multi-Mode Heat Transfer Analysis
To accurately estimate the thermal distribution of the Duni plug, a comprehensive time-dependent conjugate heat transfer analysis was employed. This high-fidelity simulation model integrates all three fundamental modes of heat transfer: conduction, convection, and radiation. This approach allows for a precise mapping of how heat moves from the electronic components through the product’s structure.
Figure 2: Initial temperature distribution
The Role of PCB Thermal Conductivity
The simulation details revealed that the effective thermal conductivity of the printed circuit board (PCB) is the absolute dominating factor in maintaining a low LED junction temperature.
For instance, if the effective thermal conductivity of the PCB is too low, heat quickly concentrates around the LEDs. As a result, standard convection becomes ineffective at transferring heat away from the printed circuit board and the LED junction. Optimizing this conductivity is therefore critical to preventing structural degradation and safeguarding the LED’s operational lifespan.